tag:fan-out

Repurposing Josephson Junctions At The Cell Boundaries For Fan-out (UCSB)
ByTechnical Paper Link- 16 Dec, 2022 - Comments: 0

A technical paper titled "Low-Cost Superconducting Fan-Out with Repurposed Josephson Junctions" was published by researchers at UC Santa Barbara. The paper received an award at the Applied Superconductivity Conference in Oct 2022 and was highlighted in this UCSB news article. Abstract: "Superconductor electronics (SCE) promise computer systems with orders of magnitude higher speeds and lo...» read more

Which Foundry Is In The Lead? It Depends.
ByEd Sperling- 26 Oct, 2022 - Comments: 2

The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google...» read more

Technology Advances, Shortages Seen For Wire Bonders
ByMark LaPedus- 17 Feb, 2022 - Comments: 2

d激增emand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no...» read more

Future Challenges For Advanced Packaging
ByMark LaPedus- 20 Jan, 2022 - Comments: 1

Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ...» read more

Next Steps For Panel-Level Packaging
ByMark LaPedus- 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a...» read more

A Broad Look Inside Advanced Packaging
ByMark LaPedus- 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ...» read more

Fan-Out And Packaging Challenges
ByMark LaPedus- 06 Oct, 2021 - Comments: 2

半导体工程坐下来讨论变化ous IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa...» read more

Angstrom-Level Measurements With AFMs
ByMark LaPedus- 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0...» read more

Ultra-Small Fan-Out Packaging Solution
ByKen Hsiao- 19 Aug, 2021 - Comments: 0

With the advent of the Internet and multimedia, electronics miniaturization in the form of integrated circuits has become an indispensable part of our lives. To ensure its long-term operation and reliability, the rapid development of integrated circuits depends on advancements in not only the design and manufacturing of chips, but also its packaging. As the market demand for consumer and com...» read more

Piecing Together Chiplets
ByMark LaPedus- 22 Jul, 2021 - Comments: 3

Several companies are implementing the chiplet model as a means to develop next-generation 3D-like chip designs, but this methodology still has a long way to go before it becomes mainstream for the rest of the industry. It takes several pieces to bring up a 3D chip design using the chiplet model. A few large players have the pieces, though most are proprietary. Others are missing some key co...» read more

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